Part for semiconductor device



FIG. 1 is a front view of a part for semiconductor device showing my new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a perspective view thereof;

FIG. 8 is an enlarged cross-sectional view taken along line 8-8 in FIG. 1;

FIG. 9 is an enlarged cross-sectional view taken along line 9-9 in FIG. 1;

FIG. 10 is an enlarged cross-sectional view taken along line 10-10 in FIG. 1;

FIG. 11 is an enlarged cross-sectional view of a portion labeled 11′-11′ in FIG. 1 and a portion labeled 11″-11″ in FIG. 5 taken along line 11-11 in FIG. 1; and,

FIG. 12 is an enlarged cross-sectional view of a portion labeled 12′-12′ in FIG. 1 and a portion labeled 12″-12″ in FIG. 5 taken along line 12-12 in FIG. 1.

The features shown in broken lines depict environmental subject matter only and form no part of the claimed design. 

CLAIM The ornamental design for a part for semiconductor device, as shown and described. 